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| HA13408 9-Channel Power Driver ADE-207-206 (Z) 1st Edition July 1996 Description The HA13408 9-channel power driver IC is designed to drive dot matrix printer head. This IC can drive 9 pins without using any external components. HA13408 can be used for 2 system four-phase step drive, as every channel is used independently. Features * * * * * * * * High output current: 1.5 A/channel Max High sustaining voltage: 50 V Min Low saturation voltage Low supply current Low input current Compatible with TTL, LSTTL & 5 V CMOS Low thermal resistance package Zener diodes Truth Table Input Low High Open Output On Off Off HA13408 Block Diagram VCC2 VCC1 4 to 6 V 2 Out 1 IN 1 24 V 10% 1 4 Out 2 IN 2 3 6 Out 3 IN 3 7 8 5 GND IN 4 10 9 Out 4 Out 5 IN 5 12 11 Out 6 IN 6 14 15 13 GND IN 7 16 17 Out 7 Out 8 IN 8 18 21 Out 9 IN 9 20 23 19 22 GND GND TAB 2 HA13408 Peak Current and Turn-Off Time Figure 1 shows load current (Iout) and output terminal voltage (Vout) waveforms for the HA13408 driving an inductive load. Hi Low Vin ton T IP Iout 0 tsus VCE(sus) Vout VCC2 VCE(sat) Figure 1 Output Waveforms The peak output current (Ip) and sustain time (tsus) are obtained as follows; IP = VCC2 - VCE(sat) R 1 - exp - R ton L .V = CC2 . R 1 - exp - R ton L (1) tsus = L IP * R ln 1 + R VCE(sus) - VCC2 (2) Where L is load self-inductance and R is load direct current resistance. For example, under the following conditions: L = 5 mH, R = 22 Supply voltage VCC2 = 24 V, Time to drive load ton = 0.42 ms. Peak current (Ip) and sustain time (tsus) are then: IP = 0.87 A 3 HA13408 tsus = 0.118 ms Where VCE(sat) = 1.3 V typ and VCE(sus) = 52 V typ. Power Dissipation Power dissipation driving an inductive load for an HA13408 is determined as follows: First, average power dissipation (Pon) per channel at ton is obtained as follows: . Pon = VCE(sat) IP . VCC2 1 - R * IP ton L R (3) Average power dissipation (Psus) at t sus : . Psus = VCE(sus) IP . L VCE(sus) - VCC2 1 - R * IP tsus R (4) Where IP and tsus are obtained in equations (1) and (2). Average power dissipation (P T ) per channel for a period is obtained as follows: .1 PT = . T (Pon * ton + Psus * tsus) (5) Where drive period is defined as T. Power dissipation (PT ) for 9 channels driven at the same time: .9 PT = . T (Pon * ton + Psus * tsus) (6) 4 HA13408 Application +5 V 2 4 6 8 10 12 14 16 18 20 22 19 13 5 1 3 7 9 11 15 17 21 23 Tab +24 V MPU Printer Head 5V 2 4 6 8 10 12 14 16 18 20 22 19 13 5 1 3 7 9 11 15 17 21 23 Tab Stepper for Paper Feeder Stepper for Head Feeder MPU Figure 2 Dot Matrix Printer 5 HA13408 Absolute Maximum Ratings (Ta = 25C) Item Supply voltage Input voltage Output voltage Output current Power dissipation Junction temperature Symbol VCC1 VI VCE(sus) IO PT Tj Rating 7.0 VCC1 50 1.5 20 150 -20 to +125 -55 to +125 Unit V V V A W C C C 1 Notes Operating junction temperature range Tjop Storage temperature range Notes: 1. Thermal resistance Tstg j - a 40C/W j - c 3C/W Electrical Characteristics (Ta = 25C, VCC1 = 5 V) Item Input Low voltage Input High voltage Input Low current Input HIgh current Supply current Symbol Min VIL VIH I IL I IH I CCO I CC Output cut off current Output saturation voltage Output sustaining voltage Delay time I CEO VCE(sat) VCE(sus) t PLH t PHL Note: -- 2.0 -100 -10 -- -- -- -- 50 -- -- Typ -- -- -15 0 30 33 -- 1.6 -- 1.5 0.3 Max 0.8 -- +10 +10 45 50 1.0 2.2 -- 5 5 Unit V V A A mA mA mA V V s s Test Conditions VCC1 = 4.0 V VCC1 = 6.0 V VI = 0 V VI = 2.4 V All V I = 2.4 V All V I = 0 V VCC1 = 6 V, VCC2 = 40 V, VI =2 .0 V VCC1 = 4 V, IO = 1.0 A, VI = 0.8 V I O = 1.0 A Turn OFF Turn ON 1 Note 1. The conditions of loading; Measure at Ls = 5 mH, Rs = 22 . 6 HA13408 Package Dimensions Unit: mm 30.0 31.0 Max 3.8 Max 3.6 0.2 28.0 0.3 20.0 0.2 4.1 0.3 14.7 Max 11.2 0.3 3.6 0.2 1.5 Max 1 1.23 0.25 1.27 2.54 23.97 0.30 0.6 0.1 23 6.2 Min 2.2 0.5 SP-23TA -- -- 4.61 g 1.80 0.25 5.0 Min Hitachi Code JEDEC EIAJ Weight (reference value) 7 12.33 0.45 7.7 9.0 0.25 + 0.10 - 0.05 Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi's or any third party's patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party's rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi's sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi's sales office for any questions regarding this document or Hitachi semiconductor products. Hitachi, Ltd. Semiconductor & Integrated Circuits. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109 URL NorthAmerica : http:semiconductor.hitachi.com/ Europe : http://www.hitachi-eu.com/hel/ecg Asia (Singapore) : http://www.has.hitachi.com.sg/grp3/sicd/index.htm Asia (Taiwan) : http://www.hitachi.com.tw/E/Product/SICD_Frame.htm Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm Japan : http://www.hitachi.co.jp/Sicd/indx.htm For further information write to: Hitachi Semiconductor (America) Inc. 179 East Tasman Drive, San Jose,CA 95134 Tel: <1> (408) 433-1990 Fax: <1>(408) 433-0223 Hitachi Europe GmbH Electronic components Group Dornacher Strae 3 D-85622 Feldkirchen, Munich Germany Tel: <49> (89) 9 9180-0 Fax: <49> (89) 9 29 30 00 Hitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 778322 Hitachi Asia Pte. Ltd. 16 Collyer Quay #20-00 Hitachi Tower Singapore 049318 Tel: 535-2100 Fax: 535-1533 Hitachi Asia Ltd. Taipei Branch Office 3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105) Tel: <886> (2) 2718-3666 Fax: <886> (2) 2718-8180 Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Tsim Sha Tsui, Kowloon, Hong Kong Tel: <852> (2) 735 9218 Fax: <852> (2) 730 0281 Telex: 40815 HITEC HX Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan. |
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